The **ATS-20F-59-C2-R0** is a specific electronic cooling component, specifically a **high-performance heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific data regarding its dimensions, thermal resistance, and material properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-20F-59-C2-R0 | | **Heat Sink Type** | Push-Pin | | **Fin Type** | Straight Fin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~6.31 °C/W (at 1.0 m/s airflow) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and clearance. | Dimension | Measurement | | :--- | :--- | | **Length** | 35.00 mm | | **Width** | 35.00 mm | | **Height** | 20.00 mm | | **Pitch (Attachment)** | 40.00 mm (center-to-center) | --- ### 3. Attachment Mechanism: Push-Pin The "C2" in the part number indicates the attachment style and Thermal Interface Material (TIM). * **Attachment:** Uses a **brass push-pin** with a **stainless steel spring**. * **Ease of Use:** Designed to be easily installed into pre-drilled holes on the PCB, providing consistent pressure to ensure optimal thermal contact. * **TIM:** Typically comes pre-applied with a high-performance thermal phase-change material to reduce interface resistance. --- ### 4. Application Context This part is typically used in environments where active or passive airflow is present to dissipate heat from surface-mount components. * **Telecommunications:** Network switches and routers. * **Industrial:** Power supplies and embedded computing boards. * **Testing:** Used in development kits where components run at high clock speeds and generate significant heat. ---