### Electronic Component Overview: ATS-20F-55-C2-R0 The **ATS-20F-55-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is specifically designed for component cooling in electronics, such as CPUs, GPUs, and power modules. --- ### Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20F-55-C2-R0 | | **Heat Sink Type** | Push-Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Thermal Resistance** | 2.39 °C/W (@ 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### Key Features and Design 1. **Push-Pin Attachment**: - This part uses a specialized **push-pin and spring mechanism**. This ensures consistent pressure between the heat sink and the electronic component, optimizing thermal transfer. - It requires pre-drilled holes in the Printed Circuit Board (PCB). 2. **Cross-Cut Fin Design**: - The "F" in the part number often denotes a specific fin configuration. The cross-cut pattern allows for omnidirectional airflow, making it effective in systems where air direction might change or is turbulent. 3. **Material & Finish**: - Constructed from high-grade aluminum for lightweight thermal conductivity. - The **Blue Anodized** finish provides better surface emissivity and protects the aluminum from corrosion. 4. **Thermal Interface Material (TIM)**: - The **-R0** suffix typically indicates that the part comes with a pre-applied thermal pad or phase-change material (T766), which simplifies the assembly process and ensures no air gaps exist between the chip and the heat sink. --- ### Applications * **Networking Equipment**: Switches and routers. * **Embedded Systems**: Industrial PCs and controllers. * **Power Supplies**: Cooling MOSFETs or Voltage Regulators. * **Computing**: Small Form Factor (SFF) motherboards and chipsets. ---