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  • ATS-20F-48-C2-R0

  • AI
    The **ATS-20F-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Here are the core technical details: | Attribute | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Style** | XC-Cut (Cross-Cut) | | **Thermal Resistance** | ~7.59°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision sizing is critical for PCB layout and clearance. | Dimension | Value | | :--- | :--- | | **Length/Width** | 40mm x 40mm | | **Height** | 25mm | | **Mounting Hole Spacing** | ~45mm (C-to-C) | | **Weight** | ~28 grams | --- ### 3. Key Electronic/Mechanical Features #### A. XC-Cut Fin Design The "XC-Cut" refers to a cross-cut straight fin geometry. Unlike standard straight fins, these provide multi-directional airflow capabilities, making them more efficient in systems where airflow direction might fluctuate or be turbulent. #### B. Push-Pin Attachment The `-R0` suffix indicates the use of a **Push-Pin** mounting system. - **Benefits:** Provides consistent pressure for optimal thermal transfer. - **Components:** Includes a brass or plastic pin and a high-compression spring. - **Requirement:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (T766) This heat sink comes with **T766** phase-change material pre-applied to the base. This ensures that microscopic air gaps between the component (chip) and the heat sink are filled, significantly reducing thermal resistance. #### D. Blue Anodized Finish The blue anodization is not just aesthetic; it provides: - Increased surface emissivity. - Protection against corrosion. - Electrical insulation of the aluminum surface. --- ### 4. Application Use Cases This specific model is commonly found in: * **Networking Equipment:** Routers and switches. * **Industrial PCs:** High-heat embedded controllers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. ---
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve optimal cooling for this heat sink?
    • ⤷ Can the T766 thermal material be replaced with standard thermal paste?
    • ⤷ What is the recommended PCB hole diameter for the ATS push-pin system?