ATS-20F-48-C2-R0
AI

The **ATS-20F-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS. Here are the core technical details:
| Attribute | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Attachment Method** | Push-Pin (Plastic) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Fin Style** | XC-Cut (Cross-Cut) |
| **Thermal Resistance** | ~7.59°C/W (at 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Physical Dimensions
Precision sizing is critical for PCB layout and clearance.
| Dimension | Value |
| :--- | :--- |
| **Length/Width** | 40mm x 40mm |
| **Height** | 25mm |
| **Mounting Hole Spacing** | ~45mm (C-to-C) |
| **Weight** | ~28 grams |
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### 3. Key Electronic/Mechanical Features
#### A. XC-Cut Fin Design
The "XC-Cut" refers to a cross-cut straight fin geometry. Unlike standard straight fins, these provide multi-directional airflow capabilities, making them more efficient in systems where airflow direction might fluctuate or be turbulent.
#### B. Push-Pin Attachment
The `-R0` suffix indicates the use of a **Push-Pin** mounting system.
- **Benefits:** Provides consistent pressure for optimal thermal transfer.
- **Components:** Includes a brass or plastic pin and a high-compression spring.
- **Requirement:** Requires pre-drilled holes in the Printed Circuit Board (PCB).
#### C. Thermal Interface Material (T766)
This heat sink comes with **T766** phase-change material pre-applied to the base. This ensures that microscopic air gaps between the component (chip) and the heat sink are filled, significantly reducing thermal resistance.
#### D. Blue Anodized Finish
The blue anodization is not just aesthetic; it provides:
- Increased surface emissivity.
- Protection against corrosion.
- Electrical insulation of the aluminum surface.
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### 4. Application Use Cases
This specific model is commonly found in:
* **Networking Equipment:** Routers and switches.
* **Industrial PCs:** High-heat embedded controllers.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
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- ⤷
What are the airflow requirements to achieve optimal cooling for this heat sink?
- ⤷ Can the T766 thermal material be replaced with standard thermal paste?
- ⤷ What is the recommended PCB hole diameter for the ATS push-pin system?