The **ATS-20F-29-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the high-performance heatsink family, specifically designed for cooling integrated circuits (ICs) and other heat-generating electronic components. --- ## 1. Component Overview This part is a **push-pin heatsink** designed for efficient thermal management. It utilizes a straight-fin design to maximize surface area for air cooling. ### Key Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20F-29-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring there is no interference with surrounding components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 20.00 mm * **Pitch (between pins):** Approximately 38.00 mm (Standard for this series) --- ## 3. Thermal Performance Thermal resistance is measured in degrees Celsius per Watt (°C/W). Lower values indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM (1.0 m/s)** | ~7.57 | | **300 LFM (1.5 m/s)** | ~4.48 | | **400 LFM (2.0 m/s)** | ~3.32 | --- ## 4. Key Electronic & Mechanical Features ### A. Attachment System The **"Push-Pin"** system uses a spring-loaded mechanism. This ensures: * **Constant Pressure:** Maintains a firm contact between the heatsink base and the chip. * **Reliability:** More secure than adhesive tapes in high-vibration environments. * **Ease of Assembly:** Can be installed quickly using pre-drilled holes in the PCB. ### B. Material & Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Not only aesthetic but also increases the surface emissivity, slightly improving radiation cooling and providing corrosion resistance. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material or high-performance thermal pad that fills the microscopic air gaps between the processor and the heatsink, significantly reducing thermal resistance at the interface. --- ## 5. Typical Applications * **CPUs and GPUs:** In embedded systems or industrial PCs. * **Telecommunications:** Cooling for FPGAs and ASICs in networking gear. * **Power Supplies:** Heat dissipation for high-power transistors.