### Overview of ATS-20F-196-C2-R0 The **ATS-20F-196-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components such as processors, FPGAs, and ASICs where space is limited but thermal demands are high. --- ### 1. Technical Specifications | Feature | Details | | :--- | :--- | | **Component Type** | Passive Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | **pushPIN™** (Provides secure mounting) | | **Thermal Resistance** | 6.17 °C/W (at 200 LFM) | | **Dimensions** | 45mm x 45mm x 10mm | | **Fin Style** | Tapered Fin Design | --- ### 2. Design and Engineering Features * **maxiFLOW™ Geometry:** The unique flared fin structure increases the surface area for heat dissipation while maintaining a low pressure drop. This design allows it to perform exceptionally well in high-velocity airflow environments. * **pushPIN™ Attachment:** This model uses a specialized attachment mechanism that includes a high-performance compression spring. This ensures a consistent and reliable pressure on the component (TIM - Thermal Interface Material), optimizing heat transfer. * **Material and Finish:** Made from aluminum for lightweight thermal conductivity and finished with a **Blue Anodized** coating to prevent corrosion and improve emissivity. --- ### 3. Thermal Performance Metrics Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM | 6.17 | | 300 LFM | 4.77 | | 400 LFM | 4.01 | | 500 LFM | 3.54 | | 600 LFM | 3.22 | --- ### 4. Typical Applications * **Networking Hardware:** Switches, routers, and high-speed modems. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and power modules that generate localized heat. ---