The **ATS-20F-18-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 15mm | | **Fin Style** | XC (Cross-Cut) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 13.38°C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature that describes its physical and thermal characteristics: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **20**: The specific series or design family. * **F**: Fin pitch/density (e.g., Fine). * **18**: Designates specific internal geometry or height variations. * **C2**: Indicates the material/finish (Aluminum with Blue Anodized finish). * **R0**: Versioning or packaging code. --- ### 3. Key Features #### A. Attachment Mechanism The "Push-Pin" design utilizes a flexible attachment system that includes: * **Nylon Pins:** To secure the sink to pre-drilled holes in the PCB. * **Compression Springs:** These provide constant pressure (7-10 lbs) to ensure a tight interface between the heat sink and the electronic component (CPU, FPGA, etc.), maximizing heat transfer. #### B. Cross-Cut (XC) Fin Design The fins are cut in a cross pattern. This creates a large surface area and allows for **multi-directional airflow**. Unlike straight-fin heat sinks, XC sinks are efficient even if the cooling air is coming from different angles or is turbulent. #### C. Thermal Interface Material (TIM) The "R0" often indicates the inclusion of a pre-applied thermal interface material, typically **ATS-PPS-18**, which eliminates the need for manual application of thermal paste during assembly. --- ### 4. Application Use Cases * **Integrated Circuits (ICs):** Cooling high-speed processors or FPGAs. * **Networking:** Used in routers and switches where airflow might be irregular. * **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is required due to the spring-loaded pins. ---