The **ATS-20F-147-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 13.52°C/W @ 1.0 m/s (LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### A. Material Composition The body is made of **Aluminum**, which is the industry standard for heat dissipation due to its high thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just for aesthetics; it increases the surface emissivity, slightly improving radiation heat transfer and providing corrosion resistance. ### B. Thermal Interface Material (TIM) This part comes with **T766** pre-applied. The TIM is critical in electronics because it fills the microscopic air gaps between the component (e.g., a CPU) and the heat sink, significantly reducing contact thermal resistance. ### C. Mounting Mechanism (Push Pin) The "20F" designation typically refers to the specific attachment hole spacing and spring tension. The push-pin system ensures: * **Constant Pressure:** Maintains optimal contact between the heat sink and the chip. * **Secure Attachment:** More reliable than adhesive tapes in high-vibration environments. --- ## 3. Thermal Performance Data Performance varies based on the airflow (Velocity) within the electronic enclosure: | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (200 LFM) | 13.52 | | 2.0 (400 LFM) | 7.53 | | 3.0 (600 LFM) | 5.83 | --- ## 4. Usage Considerations * **Component Size:** Designed for chips roughly 30mm x 30mm or smaller. * **Clearance:** The 10mm low-profile height makes it suitable for slim electronic housings or 1U server racks. * **PCB Preparation:** Requires specific pre-drilled holes in the PCB to accommodate the push pins.