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  • ATS-20F-13-C2-R0

  • AI
    The **ATS-20F-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ HS Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin | | **Thermal Resistance** | 13.70°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout planning. | Dimension | Value (mm) | | :--- | :--- | | **Length** | 50.00 mm | | **Width** | 50.00 mm | | **Height** | 15.00 mm | | **Pitch (Hole-to-Hole)** | 43.00 mm | --- ### 3. Key Electronic/Mechanical Features * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides consistent pressure for better thermal transfer and allows for easier removal or rework without damaging the PCB. * **Cross-Cut Fin Design:** The "F" in the part number often denotes a specific fin pattern (Cross-Cut). This design allows for multidirectional airflow, making it effective in systems where the cooling fan direction may vary. * **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. * **Pre-applied TIM:** The inclusion of **T766** thermal grease ensures that there are no air gaps between the electronic component (heat source) and the heat sink base, maximizing conductivity right out of the box. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Power supplies and motor drivers where thermal throttling must be avoided.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of push-pin mounting over adhesive tape for heat sinks?
    • ⤷ How does the 'LFM' (Linear Feet per Minute) affect the thermal resistance of this part?
    • ⤷ Can this heat sink be used with components larger than 50x50mm?