ATS-20F-13-C2-R0
AI

The **ATS-20F-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ HS Assembly |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin |
| **Thermal Resistance** | 13.70°C/W (Unducted Flow @ 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Physical Dimensions
The physical footprint is critical for PCB layout planning.
| Dimension | Value (mm) |
| :--- | :--- |
| **Length** | 50.00 mm |
| **Width** | 50.00 mm |
| **Height** | 15.00 mm |
| **Pitch (Hole-to-Hole)** | 43.00 mm |
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### 3. Key Electronic/Mechanical Features
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides consistent pressure for better thermal transfer and allows for easier removal or rework without damaging the PCB.
* **Cross-Cut Fin Design:** The "F" in the part number often denotes a specific fin pattern (Cross-Cut). This design allows for multidirectional airflow, making it effective in systems where the cooling fan direction may vary.
* **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves radiant heat emission.
* **Pre-applied TIM:** The inclusion of **T766** thermal grease ensures that there are no air gaps between the electronic component (heat source) and the heat sink base, maximizing conductivity right out of the box.
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### 4. Typical Applications
* **Embedded Systems:** Industrial PCs and controllers.
* **Telecommunications:** High-speed routers and switches.
* **Power Electronics:** Power supplies and motor drivers where thermal throttling must be avoided.
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What are the advantages of push-pin mounting over adhesive tape for heat sinks?
- ⤷ How does the 'LFM' (Linear Feet per Minute) affect the thermal resistance of this part?
- ⤷ Can this heat sink be used with components larger than 50x50mm?