The **ATS-20F-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions Inc. It is designed to dissipate heat from electronic integrated circuits (ICs) and other heat-generating components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is a breakdown of its primary specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 50.00mm x 50.00mm | | **Height (Off Base)** | 25.00mm | | **Fin Style** | XC-CUT (Cross-Cut) | | **Thermal Resistance** | 3.28°C/W (at 100 LFM) | --- ### 2. Key Component Features #### A. XC-CUT Fin Design The heat sink features a **cross-cut** fin pattern. This design allows for: * **Omni-directional Airflow:** Unlike straight-fin heat sinks that require air to move in one specific direction, cross-cut fins can accept airflow from various angles, making them ideal for crowded PCB layouts. * **Increased Surface Area:** The pattern maximizes the area available for heat transfer to the surrounding air. #### B. pushPIN™ Attachment System This component uses a specialized mounting mechanism: * **Plastic Push Pins:** These snap into pre-drilled holes on the PCB. * **Compression Springs:** These ensure a consistent and high-pressure interface between the heat sink and the electronic component (CPU, GPU, or MOSFET). * **Reliability:** The spring-loaded nature prevents the heat sink from shifting during mechanical shock or vibration. --- ### 3. Application Use Cases The ATS-20F-124-C2-R0 is typically used in the following electronic environments: 1. **Telecommunications:** Cooling high-speed processors in switches and routers. 2. **Power Supplies:** Managing heat for high-power transistors. 3. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. --- ### 4. Thermal Performance Overview Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.28 | | 300 (1.5 m/s) | 1.49 | | 500 (2.5 m/s) | 1.09 | ---