The **ATS-20E-159-C1-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is used to dissipate heat from integrated circuits (ICs), such as processors or FPGAs. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20E-159-C1-R0 | | **Heat Sink Type** | Push-Pin (Passive cooling) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin with Springs | | **Thermal Resistance** | 2.07°C/W (at 200 LFM) | | **Dimensions** | 45mm x 45mm x 10mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Design & Construction * **Heat Sink Material:** Manufactured from extruded aluminum. Aluminum is chosen for its lightweight properties and excellent thermal conductivity. The **Blue Anodized** finish provides better protection against corrosion and slightly increases emissivity. * **Straight Fin Design:** The fins are aligned in a single direction. This design is optimized for environments with **forced convection** (air flowing from a fan in a specific direction). * **Push-Pin Attachment:** Instead of using messy thermal adhesive or tape, this part uses plastic push-pins and metal springs. This ensures constant pressure on the chip, improving thermal transfer and allowing for easy removal/rework. --- ### 3. Thermal Performance Indicators Thermal resistance is measured in °C/W (Degrees Celsius per Watt). Lower values represent better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 m/s (200 LFM) | 2.07 | | 2.0 m/s (400 LFM) | 1.19 | | 3.0 m/s (600 LFM) | 0.93 | --- ### 4. Component Compatibility The **"R0"** suffix indicates that the product is RoHS (Restriction of Hazardous Substances) compliant, meaning it is free from lead and other hazardous materials. It is typically mounted onto PCBs with pre-drilled holes matching the 45mm x 45mm footprint.