The **ATS-20D-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-20D-99-C2-R0 | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 11.52°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Components & Design ### A. The maxiFLOW™ Fin Structure The "Electronic Part" functionality relies on its **flared fin geometry**. Unlike standard straight-fin heat sinks, these fins are angled outward. This design maximizes the surface area while increasing air turbulence, which significantly improves heat transfer from the electronic chip to the surrounding air. ### B. pushPIN™ Attachment System The part includes a mechanical assembly consisting of: * **Brass/Stainless Steel Springs:** Provide precise pressure (compression) on the electronic package. * **Plastic/Metal Push-pins:** Secure the heat sink through pre-drilled holes in the PCB. * **Benefit:** Ensures consistent contact between the sink and the chip, preventing "air gaps" that cause overheating. ### C. Thermal Interface Material (TIM) The base of the ATS-20D-99-C2-R0 comes with **T766** pre-applied. In electronics, the TIM is critical because it fills microscopic air gaps between the component die and the aluminum base, ensuring efficient thermal conductivity. --- ## 3. Usage Context This part is typically used in industrial and high-speed computing applications where standard passive cooling is insufficient. It is commonly found on: 1. **Logic Gates/ASICs:** High-density integrated circuits. 2. **Power Modules:** Where heat dissipation is required in a small footprint. 3. **Network Switches:** Where airflow is often constrained. ---