The **ATS-20D-87-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed to provide superior thermal management for electronic components such as BGA (Ball Grid Array) chips. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20D-87-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 12.70mm | | **Attachment Method** | pushPIN™ (Brass pins / Plastic pins) | | **Thermal Resistance** | 2.70 °C/W (@ 200 LFM) | | **Fin Style** | Spread Fin (maxiFLOW™) | --- ### 2. Key Components & Design Features #### A. The Fin Geometry (maxiFLOW™) Unlike standard straight-fin heatsinks, the ATS-20D-87-C2-R0 uses a **flared-fin** design. This geometry increases the surface area and encourages more air to flow through the fin field rather than over it, significantly reducing thermal resistance in high-airflow environments. #### B. The pushPIN™ Attachment System This part uses a specific mechanical mounting system: * **Compression Spring:** Ensures consistent pressure on the processor/chip for optimal heat transfer. * **Brass/Plastic Pins:** Provides a secure mechanical fit to the PCB, preventing the heatsink from shifting during transport or vibration. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material pre-applied to the base. * **T766 Phase Change Material:** This is a high-performance thermal pad that melts at operating temperatures to fill microscopic air gaps between the heatsink and the chip. --- ### 3. Application Use Cases This component is typically found in: 1. **Networking Hardware:** Routers, switches, and base stations where high-speed processing generates significant heat. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Telecommunications:** High-power RF components. --- ### 4. Part Number Breakdown ```text ATS - 20 - D - 87 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Thermal Interface Material (T766) | | | +------------ Height (12.7mm) | | +----------------- Fin Pitch/Style | +---------------------- Number of Fins/Series +--------------------------- Manufacturer (Advanced Thermal Solutions) ```