The **ATS-20D-85-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance **maxiFLOW™** heat sink series, designed primarily for cooling BGA (Ball Grid Array) components and other surface-mount electronics. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-20D-85-C2-R0 | | **Component Type** | Heat Sink (Thermal Management) | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Pin Material** | Nylon | | **Thermal Interface (TIM)** | T766 (Pre-applied) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 2.15 °C/W (at 200 LFM) | --- ### ## Key Electronic & Mechanical Parts #### 1. The Heat Sink Body The main body is made of extruded aluminum. The **maxiFLOW™** design features a flared fin structure. This geometry is electronically significant because it reduces pressure drop and increases the surface area, allowing for better cooling of high-frequency processors or power-dense chips. #### 2. The Push-Pin Mechanism The "20D" in the part number indicates a specific push-pin and spring assembly. * **Springs:** Provide a consistent "normal force" (pressure) between the heat sink and the chip. * **Nylon Push-Pins:** These are inserted through pre-drilled holes in the PCB. They are non-conductive, ensuring no electrical shorts occur on the board traces. #### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the semiconductor die and the aluminum base. * **Electrical Property:** T766 is generally electrically insulating but thermally conductive, protecting the electronic component from static or shorting via the metal heat sink. --- ### ## Application Context This part is commonly used in: * **Telecommunications:** Cooling FPGA and ASIC chips. * **Computing:** Northbridge/Southbridge cooling on motherboards. * **Power Electronics:** Dissipating heat from high-speed switching components.