The **ATS-20D-83-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 1.60° C/W (at 1.0 m/s airflow) | | **Dimensions** | 30.00mm x 30.00mm x 20.00mm | --- ### 2. Design and Construction The "83" in the part number refers to the specific fin pattern and height designed for high-density airflow environments. * **Heat Sink Profile:** It features a square footprint (30mm) and a height of 20mm. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-efficiency phase-change material that ensures a low thermal resistance bond between the component and the heat sink. * **Attachment:** The `pushPIN™` system uses a spring-loaded mechanism to provide precise pressure, ensuring optimal contact with the electronic chip without over-tightening. --- ### 3. Thermal Performance (Flow Rate) The effectiveness of this part depends heavily on the velocity of the air moving through the fins. | Air Velocity (m/s) | Thermal Resistance (Unducted) | | :--- | :--- | | 1.0 | 1.60 °C/W | | 2.0 | 1.05 °C/W | | 3.0 | 0.86 °C/W | | 5.0 | 0.70 °C/W | --- ### 4. Typical Applications This component is used in industrial and consumer electronics where space is limited but heat generation is high: * **Networking Gear:** Switches and Routers. * **Embedded Systems:** Industrial PCs and single-board computers. * **Power Supplies:** Cooling voltage regulators or power transistors.