The **ATS-20D-79-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the high-performance family of heat sinks designed for cooling electronic components such as CPUs, GPUs, or power modules. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20D-79-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Thermal Resistance** | 7.52°C/W @ 200 LFM (Linear Feet per Minute) | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Spring Type** | Compression Spring | --- ### ## Key Electronic & Mechanical Features #### 1. Thermal Management Efficiency The "79" series features a **Straight Fin** design. This allows for optimal airflow through the fins, making it most effective in systems where there is a dedicated fan or a clear path for forced air convection. #### 2. Attachment System (pushPIN™) The "R0" at the end of the part number typically signifies the specific mounting hardware: * **Secure Fit:** It uses a spring-loaded pin system that ensures consistent pressure between the heat sink and the electronic component (IC). * **Pre-drilled Holes:** This part requires specific holes in the PCB (Printed Circuit Board) for installation. * **TIM (Thermal Interface Material):** These units usually come with a pre-applied thermal pad (often T766) to ensure high conductivity between the chip and the aluminum. #### 3. Material and Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodization:** Not only provides a professional aesthetic but also adds a thin layer of insulation and corrosion resistance. --- ### ## Applications This heat sink is typically used for cooling the following types of electronic parts: * **BGA (Ball Grid Array) Packages:** Small processors or controllers. * **FPGAs:** Programmable logic devices that generate significant heat. * **Power Transistors:** Voltage regulators or MOSFETs that require heat dissipation to prevent thermal throttling.