The **ATS-20D-75-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-20D-75-C3-R0 | | **Type** | Heatsink (Push-Pin Mount) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~5.30 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Attachment Method** | Push-Pin with Brass Springs | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Component Breakdown #### A. The Heatsink Body * **Material:** Made from extruded aluminum, which provides a balance between weight and thermal conductivity. * **Finish:** The "C3" in the code typically refers to the **Blue Anodized** finish, which protects the aluminum from corrosion and slightly increases emissivity. * **Fin Geometry:** It uses a high-density straight fin design to maximize surface area for air-to-metal heat transfer. #### B. Mounting Hardware (Push-Pins & Springs) Instead of adhesive tapes that can fail over time, this part uses **plastic push-pins** and **brass springs**. * **Reliability:** Provides constant pressure (preload) on the chip to ensure optimal contact with the thermal interface. * **Vibration Resistance:** The spring-loaded mechanism is superior for high-vibration environments compared to simple glue-on heatsinks. #### C. Thermal Interface Material (TIM) The "R0" designation usually indicates the inclusion of a specific thermal pad or phase-change material. * **T412:** This is a high-performance thermal tape or pad pre-applied to the base of the heatsink, eliminating the need for external thermal paste during assembly. --- ### 3. Common Applications This specific size (25mm x 25mm) is commonly used for cooling: 1. **Network Processors:** Routers, switches, and small-scale servers. 2. **FPGA/ASIC:** High-speed logic chips that generate significant localized heat. 3. **Power Supplies:** MOSFETs or voltage regulators requiring discrete cooling. 4. **Embedded Systems:** Industrial PCs where airflow might be limited. --- ### 4. Code Breakdown `ATS` (Brand) - `20` (Pin Type) - `D` (Spring Type) - `75` (Dimensions/Series) - `C3` (Finish) - `R0` (Revision/TIM)