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  • ATS-20D-65-C2-R0

  • AI
    ## Overview of ATS-20D-65-C2-R0 The **ATS-20D-65-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed as a thermal management solution for electronic components such as CPUs, GPUs, FPGAs, and other integrated circuits that require efficient heat dissipation. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight / Cross-Cut | | **Length** | 45.00 mm | | **Width** | 45.00 mm | | **Height (Fin Height)** | 25.00 mm | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Features and Electronic Applications 1. **pushPIN™ Attachment:** This part utilizes a specific attachment mechanism consisting of a brass or plastic pin and a stainless steel spring. In electronics manufacturing, this ensures a high degree of reliability and consistent pressure against the heat-generating component. 2. **Blue Anodized Finish:** Beyond aesthetics, the anodized coating increases the surface area's emissivity and provides a layer of corrosion resistance, which is vital for long-term reliability in industrial electronic environments. 3. **T766 Thermal Interface Material:** The part comes with a pre-applied TIM. This eliminates the need for manual application of thermal paste, ensuring an even and efficient thermal transfer between the semiconductor surface and the aluminum heat sink. 4. **Cross-Cut Fin Design:** The geometry of the fins is optimized for airflow from multiple directions. This makes it ideal for densely packed printed circuit boards (PCBs) where airflow might be turbulent or non-directional. --- ### Component Dimensions and Mounting To integrate this into a PCB design, the following hole pattern is required: * **Hole Pitch (X-Axis):** 50.00 mm * **Hole Pitch (Y-Axis):** 50.00 mm * **Pin Type:** Brass or Plastic (depending on specific sub-variant) ---
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at high airflow speeds (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is the pushPIN attachment compatible with standard PCB hole sizes?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?