ATS-20D-65-C2-R0
AI

## Overview of ATS-20D-65-C2-R0
The **ATS-20D-65-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is specifically designed as a thermal management solution for electronic components such as CPUs, GPUs, FPGAs, and other integrated circuits that require efficient heat dissipation.
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### Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Type** | Straight / Cross-Cut |
| **Length** | 45.00 mm |
| **Width** | 45.00 mm |
| **Height (Fin Height)** | 25.00 mm |
| **Thermal Resistance** | 7.29 °C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### Key Features and Electronic Applications
1. **pushPIN™ Attachment:**
This part utilizes a specific attachment mechanism consisting of a brass or plastic pin and a stainless steel spring. In electronics manufacturing, this ensures a high degree of reliability and consistent pressure against the heat-generating component.
2. **Blue Anodized Finish:**
Beyond aesthetics, the anodized coating increases the surface area's emissivity and provides a layer of corrosion resistance, which is vital for long-term reliability in industrial electronic environments.
3. **T766 Thermal Interface Material:**
The part comes with a pre-applied TIM. This eliminates the need for manual application of thermal paste, ensuring an even and efficient thermal transfer between the semiconductor surface and the aluminum heat sink.
4. **Cross-Cut Fin Design:**
The geometry of the fins is optimized for airflow from multiple directions. This makes it ideal for densely packed printed circuit boards (PCBs) where airflow might be turbulent or non-directional.
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### Component Dimensions and Mounting
To integrate this into a PCB design, the following hole pattern is required:
* **Hole Pitch (X-Axis):** 50.00 mm
* **Hole Pitch (Y-Axis):** 50.00 mm
* **Pin Type:** Brass or Plastic (depending on specific sub-variant)
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- ⤷
What is the thermal resistance of this heat sink at high airflow speeds (e.g.
- ⤷ 500 LFM)?
- ⤷ Is the pushPIN attachment compatible with standard PCB hole sizes?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?