The **ATS-20D-35-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "maxiFLOW™" product line, designed primarily for cooling electronic components like BGA (Ball Grid Array) packages. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 36.83 mm x 36.83 mm | | **Height** | 35.00 mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.10 °C/W @ 200 LFM | | **Flow Pattern** | Directional (Straight Fin) | | **Regulatory Compliance** | RoHS & REACH Compliant | --- ### 2. Electronic/Thermal Component Breakdown #### A. Thermal Management Strategy This part is a **passive cooling component**. Its primary function is to increase the surface area of an integrated circuit (IC), allowing heat to dissipate more efficiently into the surrounding air via convection. #### B. The maxiFLOW™ Design Unlike standard cross-cut heat sinks, the maxiFLOW design features a **tapered fin structure**. This reduces "pressure drop" and maximizes air velocity through the fins, making it ideal for high-density electronic assemblies where airflow might be restricted. #### C. The pushPIN™ Attachment System The "R0" in the part number indicates the mounting hardware. The pushPIN™ system includes: * **Compression Springs:** Ensure even pressure across the surface of the chip (Thermal Interface Material or TIM). * **Plastic/Brass Pins:** Secure the heat sink directly to the PCB through pre-drilled holes. --- ### 3. Part Number Nomenclature Understanding the code helps in identifying variations of this part: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **20D** | Series/Product Family | | **35** | Height in Millimeters (35mm) | | **C2** | Thermal Interface Material (includes T766 phase change material) | | **R0** | Package/Revision (includes pushPIN assembly) | --- ### 4. Applications This heat sink is typically used on electronic components that generate significant heat during operation, such as: * **FPGAs & CPUs:** High-speed processing units. * **ASICs:** Application-specific integrated circuits in networking gear. * **Power Supplies:** High-wattage DC-DC converters.