The **ATS-20D-33-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for efficient thermal management of surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) / Copper (optional base versions) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 20.0mm | | **Thermal Resistance** | 17.42 °C/W (at 100 LFM) to 2.62 °C/W (at 700 LFM) | | **Attachment Type** | pushPIN™ (Spring-loaded pins) | | **TIM (Thermal Interface Material)** | T766 (High performance) | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the product's attributes: * **ATS-20**: Refers to the series and specific internal catalog ID. * **D**: Indicates the fin pitch/density (Standard or High density). * **33**: Represents the physical footprint size (typically 35mm in this series). * **C2**: Refers to the specific thermal performance grade or material combination. * **R0**: Indicates the revision number and packaging/shipping standards. --- ### 3. Key Electronic Components & Materials While the heat sink itself is a passive mechanical part, its "electronic" utility is defined by its assembly components: * **The Heat Sink Body:** Made of extruded aluminum, which provides a high surface-area-to-volume ratio to dissipate heat into the surrounding air. * **Spring-Loaded pushPINs:** These ensure a consistent, pre-measured pressure (load) is applied to the electronic chip. This prevents damage to the silicon while ensuring the best possible thermal contact. * **Thermal Interface Material (TIM):** Pre-applied to the base. This material fills microscopic air gaps between the chip and the heat sink, which is critical because air is a poor conductor of heat. * **Compression Springs:** Brass or steel springs that provide the required force for the attachment mechanism. --- ### 4. Application Use Case This part is typically used in: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Industrial PCs:** Maintaining stable temperatures in fanless or low-airflow environments. 3. **Embedded Systems:** Protecting sensitive logic controllers from thermal throttling.