The **ATS-20D-182-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 40.00mm x 40.00mm x 15.00mm | | **Thermal Resistance** | 7.51°C/W (Unducted Flow @ 200 LFM) | | **Weight** | 35.0 grams | | **Fins** | Fine-pitch straight fin design | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "20D" series utilizes a mechanical pushPIN™ system. This ensures: * **Constant Pressure:** A high-performance compression spring provides uniform pressure across the thermal interface material (TIM). * **Secure Mounting:** It prevents the heat sink from shifting due to vibration or thermal expansion. * **Ease of Assembly:** Pre-drilled holes in the PCB allow for quick installation. ### B. Thermal Interface Material (TIM) The "C2" suffix in the part number indicates that the heat sink comes pre-applied with **T766 Phase Change Material**. This is an advanced thermal grease alternative that softens at operating temperatures to fill microscopic air gaps between the chip and the aluminum, maximizing heat transfer. ### C. Thermal Performance The design is optimized for high-density electronic packaging. The thermal resistance of **7.51°C/W** means that for every watt of power the chip dissipates, the temperature of the chip will rise by 7.51 degrees Celsius above the ambient air temperature (assuming a moderate airflow of 200 LFM). --- ## 3. Part Number Breakdown The nomenclature follows a specific logic: 1. **ATS:** Manufacturer (Advanced Thermal Solutions). 2. **20D:** The specific product family (pushPIN™ Heat Sink). 3. **182:** Specific dimensional and fin configuration. 4. **C2:** Thermal Interface Material type (T766). 5. **R0:** Revision code / RoHS Compliance status. ---