The **ATS-20D-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and physical specifications. --- ## 1. Core Specifications This part is designed for high-density electronic packaging where airflow direction may be inconsistent or multidirectional. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 6.67°C/W @ 100 LFM (Unducted) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | --- ## 2. Electronic/Thermal Performance In electronics, thermal resistance ($\theta$) determines how efficiently heat is moved away from a semiconductor junction (like a CPU, FPGA, or MOSFET). ### Airflow vs. Thermal Resistance The effectiveness of this part scales with the velocity of the cooling fan (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 6.67 | | **200 (1.0 m/s)** | 2.80 | | **400 (2.0 m/s)** | 1.74 | | **600 (3.0 m/s)** | 1.39 | --- ## 3. Mechanical & Assembly Parts The "C2-R0" suffix denotes specific hardware and finish options: ### Attachment System: pushPIN™ * **Push-Pin:** Uses a plastic or brass pin that snaps into pre-drilled holes on the PCB. * **Spring:** A high-performance compression spring ensures constant pressure between the heat sink and the electronic component to minimize the air gap. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **ATS-PPS-20**, a high-conductivity phase-change material or grease. ### Dimensional Breakdown * **Fin Type:** Cross-cut (Pin Fin). This allows for "omni-directional" airflow, meaning it works regardless of which way the fan is blowing. * **Pitch:** Fine-pitch design for maximum surface area in a 45mm square footprint. --- ## 4. Typical Applications This component is used to cool integrated circuits (ICs) in the following electronic sectors: * **Telecommunications:** Network switches and routers. * **Power Electronics:** Large voltage regulators and power supplies. * **Embedded Computing:** Cooling industrial-grade CPUs and FPGAs.