The **ATS-20D-07-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" thermal management line, designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Pitch** | Fine Pitch | | **Pattern** | XC-CUT | | **Thermal Resistance** | 17.00°C/W (Unducted @ 100 LFM) | --- ### 2. Design Components The assembly consists of three main electronic/mechanical elements: 1. **Heat Sink Body:** * Uses a **straight fin** or **XC-CUT** design to maximize surface area for heat dissipation. * The 15mm height makes it a "low profile" solution suitable for compact electronic enclosures (1U servers, embedded systems). 2. **The pushPIN™ Mechanism:** * Consists of a plastic or metal pin with a compression spring. * Ensures a constant, specified pressure on the electronic component (IC), which is critical for maximizing the efficiency of the Thermal Interface Material (TIM). 3. **Thermal Interface Material (TIM):** * The "R0" suffix usually indicates that the unit comes pre-applied with **T766** or similar high-performance thermal grease, ensuring no air gaps exist between the chip and the aluminum. --- ### 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): * **100 LFM:** 17.00 °C/W * **300 LFM:** 7.50 °C/W * **500 LFM:** 5.10 °C/W * **700 LFM:** 4.20 °C/W *Note: Lower °C/W values indicate better cooling efficiency.* --- ### 4. Implementation Code Example In thermal simulation or PCB design software (like Altium or Eagle), you might define the footprint. While it is a mechanical part, its clearance is vital in your layout. ```yaml # Component Metadata Part_Number: "ATS-20D-07-C2-R0" Category: "Thermal Management / Heat Sinks" Package_Footprint: "45.0mm x 45.0mm" Mounting_Hole_Spacing: "38.0mm x 38.0mm" Material_Type: "AL-6063" ```