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  • ATS-20D-06-C2-R0

  • AI
    The **ATS-20D-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics essential for PCB design and thermal calculation. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 1.83°C/W (at 200 LFM) | --- ### 2. Physical Design Components This component consists of three primary electronic/mechanical parts: 1. **The Heat Sink Body:** A square aluminum block with a "Pin Fin" array. Unlike straight fins, pin fins allow for omnidirectional airflow, making them more efficient in systems where the direction of air cannot be strictly controlled. 2. **The Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a high-performance thermal grease or pad that fills microscopic air gaps between the electronic component (CPU/FPGA) and the heat sink. 3. **The pushPIN™ Attachment:** It utilizes a spring-loaded mechanism. This ensures a constant, calibrated pressure (Force) against the chip, which is critical for maximizing heat transfer and preventing the sink from shifting during vibration. --- ### 3. Thermal Performance Metrics Thermal resistance ($\theta_{sa}$) determines how effectively the part cools the electronic component. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.90 | | 200 (1.0 m/s) | 1.83 | | 400 (2.0 m/s) | 1.25 | | 600 (3.0 m/s) | 0.82 | --- ### 4. Electronic Applications The **ATS-20D-06-C2-R0** is commonly used to cool high-heat-density electronic components such as: * **FPGAs & ASICs:** High-speed processing units in telecommunications. * **Voltage Regulator Modules (VRMs):** Power management circuits on high-end motherboards. * **LED Drivers:** High-output lighting controllers. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.
    ✨ Follow-up Questions
    • ⤷How do I calculate the required airflow for this heat sink?
    • ⤷ What are the advantages of blue anodizing over plain aluminum?
    • ⤷ What is the difference between push-pin and adhesive mounting?