The **ATS-20B-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, known for its high-aspect-ratio fin design which maximizes surface area for cooling. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 25mm x 25mm | | **Height** | 30.00mm | | **Thermal Resistance** | 3.59°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ | | **Pressure Spring** | Brass / Stainless Steel | --- ### 2. Key Electronic & Physical Components #### A. Fin Design (maxiFLOW™) The "maxiFLOW" geometry features a spread-fin structure. Unlike standard square heatsinks, the fins extend outward to capture more airflow from the surrounding environment. This reduces the "stagnant air" zones often found in high-density electronic assemblies. #### B. The pushPIN™ Attachment One of the critical electronic integration features is the **pushPIN™** system. - **Component:** It consists of a pre-assembled plastic or metal pin and a compression spring. - **Benefit:** This ensures consistent pressure (clamping force) on the electronic component (like a BGA or FPGA), which optimizes thermal interface material (TIM) performance and prevents the heatsink from shifting during vibration. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with a pre-applied thermal interface material (typically **Chomerics T766**). This layer bridges the microscopic air gaps between the heatsink base and the electronic chip, ensuring efficient heat transfer. --- ### 3. Application Use Cases This specific part is used for cooling medium-sized integrated circuits where vertical space is available (30mm height) but horizontal footprint is limited (25mm x 25mm). * **Network Switches/Routers:** Cooling processors or ASICs. * **Power Supplies:** Managing heat for MOSFETs or power regulators. * **Embedded Systems:** Industrial PCs where airflow might be constrained. --- ### 4. Part Number Breakdown ```text ATS - 20 - B - 75 - C3 - R0 | | | | | | | | | | | └── Thermal Interface Material (Pre-applied) | | | | └─────── Color/Finish (Blue Anodized) | | | └──────────── Specific Design Variant | | └──────────────── Attachment Type (B = pushPIN) | └───────────────────── Fin Pitch/Type └────────────────────────── Manufacturer Prefix (Advanced Thermal Solutions) ```