The **ATS-20B-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number itself follows a specific nomenclature that defines its physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Height off Base)** | 25mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 5.11°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment Unlike standard clip-on or adhesive-based heat sinks, this part uses the **pushPIN™ system**. This involves a spring-loaded mechanism that ensures: * **Constant Pressure:** Provides uniform contact between the heat sink and the component for optimal heat transfer. * **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping. * **Ease of Installation:** Uses pre-drilled holes in the PCB. #### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766 thermal phase change material**. This material is pre-applied to the base of the heat sink. When the device heats up, the material softens to fill microscopic air gaps between the chip and the heat sink, significantly lowering thermal resistance. --- ### 3. Usage Example This heat sink is typically found in industrial computing, networking equipment (routers/switches), and power supply units. ```cpp // Example: Thermal calculation for ATS-20B-72-C2-R0 float chipPower = 10.0; // Watts float ambientTemp = 25.0; // Celsius float thermalResistance = 5.11; // °C/W @ 100 LFM // Calculate estimated junction temperature float estimatedTemp = ambientTemp + (chipPower * thermalResistance); // Result: 76.1°C ``` ---