The **ATS-20B-118-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 6.52°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Interface Material (TIM)** | Pre-applied T766 Phase Change Material | --- ## 2. Key Component Features ### A. Material and Design * **Aluminum Construction:** Provides a balance between high thermal conductivity and low weight. * **Blue Anodized Finish:** Improves thermal radiation and protects the aluminum from corrosion. * **Fin Geometry:** The fins are designed to maximize surface area while maintaining low pressure drop, making them ideal for systems with forced air cooling. ### B. Attachment Mechanism (pushPIN™) The "20B" in the part number indicates the use of the **pushPIN™** system. This consists of: 1. **Plastic Pins:** Inserted through pre-drilled holes in the PCB. 2. **Compression Springs:** Provide specific, consistent pressure (clamping force) on the component to ensure optimal thermal contact. ### C. Thermal Interface Material (TIM) The **C1** designation indicates that the unit comes with **T766** thermal material pre-applied to the base. This eliminates the need for manual thermal paste application, ensuring a uniform layer that fills microscopic air gaps between the chip and the heat sink. --- ## 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.52 | | 300 (1.5 m/s) | 3.11 | | 500 (2.5 m/s) | 2.39 | | 700 (3.5 m/s) | 2.01 | --- ## 4. Typical Applications This specific size and profile are commonly found in: * **Telecommunications:** Network switches and routers. * **Embedded Computing:** Industrial PC boards. * **Power Electronics:** Voltage regulators and high-speed memory modules.