The **ATS-20B-01-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or power modules. --- ### ## Technical Specifications Below are the primary electronic and physical specifications for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Part Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance (Unducted)** | 18.35 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.63 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Type** | Fine Pitch | | **Fin Pattern** | Straight | --- ### ## Key Electronic & Mechanical Features ### 1. Thermal Management Efficiency The primary "electronic" function of this part is the dissipation of heat. In electronic circuits, excess heat leads to junction failure. The **ATS-20B-01-C2-R0** uses a fine-pitch straight fin design to maximize surface area contact with moving air, effectively lowering the operating temperature of the underlying semiconductor. ### 2. Attachment Mechanism (pushPIN™) Instead of using messy thermal adhesives or simple clips, this part uses a precision **Push-Pin** system: * **Engagement:** The pins engage with pre-drilled holes in the PCB. * **Constant Pressure:** Built-in springs ensure consistent pressure across the interface, which is critical for maintaining a thin, even layer of thermal interface material (TIM). ### 3. C2 Classification (Thermal Interface Material) The **"C2"** suffix in the part number indicates that the heat sink comes pre-applied with **ATS-NO-LOW** thermal interface material. This is a high-performance thermal grease that fills microscopic air gaps between the component and the heat sink to enhance heat transfer. --- ### ## Applications in Electronics This specific low-profile (10mm height) heat sink is typically used in: * **Networking Equipment:** Routers and switches with limited vertical clearance. * **Embedded Systems:** Industrial PCs where vibration resistance (provided by the push-pins) is required. * **Power Supplies:** Cooling voltage regulators or MOSFETs.