The **ATS-19F-95-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It belongs to the *maxiFLOW™* series, designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Fin Style** | High-Performance maxiFLOW™ (Tapered Fin) | | **Interface Material** | T766 (Thermal Grease) | --- ### 2. Key Components & Features #### A. The maxiFLOW™ Fin Design The "95" in the part number refers to a specific fin pattern. These heat sinks feature a **tapered fin design** that maximizes the surface area for heat dissipation while minimizing pressure drop. This allows air to flow more easily through the fins, increasing cooling efficiency in tight spaces. #### B. pushPIN™ Attachment System The "19F" series uses a pushPIN™ mounting system. This includes: * **Compression Springs:** Ensure even pressure across the electronic component to optimize thermal transfer. * **Flexible Options:** These pins come in various materials (Plastic or Brass) to suit different PCB requirements. #### C. Blue Anodized Finish The surface is treated with a blue anodized coating. While aesthetic, it also provides **corrosion resistance** and slightly increases the surface emissivity, which aids in radiant heat transfer. --- ### 3. Application in Electronics This part is typically used on high-heat-generating semiconductors where vertical space is available (30mm height). * **Network Switches:** Cooling high-speed processing chips. * **Power Supplies:** Managing heat in DC-DC converters. * **Embedded Systems:** Protecting industrial computers from thermal throttling. ---