The **ATS-19F-93-C2-R0** is a high-performance thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Dimensions** | 40mm x 40mm x 20mm | --- ### 2. Key Electronic & Mechanical Parts #### A. The Heat Sink Body (Finned Array) The "93" in the part number refers to the **maxiFLOW™** design. This design features a high-density finned array that increases surface area. - **Function:** Transfers heat from the component surface to the surrounding air. - **Orientation:** Designed for uni-directional or multi-directional airflow depending on the fin layout. #### B. Push-Pin Attachment Mechanism This model uses a mechanical mounting system rather than adhesive tape. - **Hardware:** Consists of plastic push-pins and metal springs. - **Benefit:** Provides consistent pressure (force) on the electronic chip, which optimizes the thermal contact and ensures the heat sink doesn't shift during vibration or shipping. #### C. Thermal Interface Material (TIM) The **C2** designation indicates the type of thermal compound pre-applied to the base. - **Material:** T766. - **Purpose:** Fills microscopic air gaps between the electronic component (die/package) and the aluminum base to lower thermal resistance. --- ### 3. Thermal Performance Indicators The efficiency of this part is measured by its thermal resistance (lower is better). | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM (1.0 m/s) | 5.42 | | 500 LFM (2.5 m/s) | 2.50 | | 800 LFM (4.0 m/s) | 1.90 | --- ### 4. Summary of Naming Convention - **ATS:** Advanced Thermal Solutions. - **19:** Part Series (maxiFLOW™). - **F:** Fin Style. - **93:** Specific size/footprint code. - **C2:** Thermal Interface Material code (T766). - **R0:** RoHS Compliance/Revision status. ---