The **ATS-19F-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets. --- ### Technical Specifications The table below outlines the core physical and thermal properties of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.36 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 25.00 mm | | **Pitch** | Fine-Pitch | | **Flow** | Cross-Cut | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (The Fins) The part utilizes a **straight-fin or cross-cut design** depending on the specific airflow optimization. This increases the surface area exposed to the air, allowing heat generated by the electronic chip to dissipate more efficiently via convection. #### 2. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical attachment: * **Springs:** Provide precise, consistent pressure across the interface to ensure maximum thermal contact. * **Pins:** Designed to fit into pre-drilled holes on the Printed Circuit Board (PCB). #### 3. Thermal Interface Material (TIM) The "C2" in the part number typically indicates the type of thermal interface material pre-applied to the base: * **Function:** It fills microscopic air gaps between the chip surface and the heat sink base. * **Performance:** High thermal conductivity to ensure low resistance from the silicon die to the aluminum fins. --- ### Thermal Performance Overview Thermal resistance (measured in °C/W) determines how much the temperature of the component will rise per watt of power dissipated. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (Unducted)** | 6.36 | 3.33 | 2.59 | 2.24 | 2.02 | --- ### Application Usage * **PCB Mounting:** Requires specific hole patterns on the board for the push-pins. * **Component Type:** Ideal for BGA (Ball Grid Array) packages. * **Environment:** Best suited for forced-air environments (systems with active cooling fans).