The **ATS-19F-85-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink** designed for cooling electronic components such as BGA (Ball Grid Array) chips, FPGAs, and processors. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 20.11°C/W (at 1.0 m/s airflow) | | **Finish** | Blue Anodized | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. - **Benefits:** Provides consistent pressure for better thermal contact and prevents the heat sink from shifting during vibration or shipping. - **Springs:** Usually paired with stainless steel springs to maintain optimal downward force. #### B. Fin Design (Straight Fin) The part utilizes a **straight fin** geometry. - These are optimized for "open-flow" environments where airflow is directed through the fins. - The 10mm low-profile height makes it ideal for compact electronic enclosures or 1U server racks. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates the inclusion of a pre-applied thermal pad or phase-change material (**T766**). This ensures that the microscopic air gaps between the heat sink and the electronic chip are filled, maximizing heat transfer efficiency. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **19** | Series/Footprint designation | | **F** | Fin style/type | | **85** | Specific internal dimension code | | **C2** | Material/Finish code (Blue Anodized Aluminum) | | **R0** | Packaging and TIM (Thermal Interface Material) designation | --- ### 4. Typical Applications * **Networking:** Routers and switches. * **Computing:** CPU/GPU cooling in embedded systems. * **Power Electronics:** Cooling MOSFETs or power modules.