ATS-19F-84-C2-R0
AI

The **ATS-19F-84-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It belongs to the "maxiFLOW™" product line, designed to reduce pressure drop and maximize airflow.
### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Number** | ATS-19F-84-C2-R0 |
| **Heat Sink Type** | Push-Pin (maxiFLOW™) |
| **Material** | Aluminum (Blue Anodized) |
| **Thermal Resistance** | 2.69°C/W (at 200 LFM) |
| **Attachment Method** | Plastic Push-Pin with Brass Springs |
| **Base Dimensions** | 30.00mm x 30.00mm |
| **Height** | 25.00mm |
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### 2. Key Electronic Features
The design of this component focuses on maximizing heat dissipation for integrated circuits (ICs) and other electronic components.
* **Tapered Fin Design:** The "maxiFLOW™" geometry features a spread-fin pattern. This reduces air resistance and increases the surface area exposed to the airflow, making it more efficient than standard straight-fin heat sinks.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **SAINT-GOBAIN C700**, which is a high-performance thermal phase-change material that ensures a low thermal resistance interface between the heat sink and the chip.
* **Secure Attachment:** The use of **push-pins** ensures consistent pressure across the surface of the processor. This prevents "tilting" and ensures the thermal interface material is compressed correctly for maximum heat transfer.
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### 3. Common Applications
This heat sink is sized for small to medium-sized electronic packages, frequently used in:
1. **Networking Hardware:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PC modules and single-board computers.
3. **Power Supplies:** Cooling MOSFETs or power regulators.
4. **Processors:** Cooling FPGAs, ASICs, or older generations of CPUs/GPUs.
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- ⤷What is the difference between push-pin and adhesive mounting for heat sinks?
- ⤷ How do I calculate the required LFM (Linear Feet per Minute) for this heat sink?
- ⤷ Are there alternative thermal interface materials for the ATS-19F series?