ATS-19F-82-C2-R0
AI

The **ATS-19F-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (with Blue Anodized Finish) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm |
| **Thermal Resistance** | 2.49°C/W (at 100 LFM) |
| **Attachment Type** | Push-Pin (Plastic/Brass) |
| **Interface Material** | T766 (Thermal Interface Material pre-applied) |
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### 2. Key Electronic Functions
While the heat sink itself is a passive mechanical part, its role in an electronic circuit is critical for longevity and performance:
1. **Thermal Dissipation:** It increases the surface area of the heat source (the semiconductor), allowing air to carry away heat more efficiently.
2. **Junction Temperature Control:** By maintaining a lower $T_j$ (Junction Temperature), it prevents "thermal throttling" in processors and prevents permanent silicon damage.
3. **EMI Shielding (Incidental):** Being a metallic mass, it can occasionally provide minor electromagnetic interference shielding for the chip beneath it, though this is not its primary purpose.
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### 3. Design Features (pushPIN™ Technology)
The "82" and "C2" segments of the part number refer to the specific mounting and thermal performance configurations:
* **Fin Design:** This model typically features a **Straight Fin** or **Cross-Cut** pattern designed for specific airflow directions.
* **Attachment:** The push-pin mechanism uses a flexible spring-loaded pin to ensure constant pressure between the heat sink and the electronic component, which optimizes the heat transfer through the Thermal Interface Material (TIM).
* **Compatibility:** Designed for PCB (Printed Circuit Board) mounting with pre-drilled holes.
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### 4. Part Number Breakdown
```text
ATS - 19 - F - 82 - C2 - R0
| | | | | |
| | | | | +-- Revision Code
| | | | +------- Color/Finish (Blue Anodized)
| | | +------------ Thermal Performance/Kit Variant
| | +----------------- Fin Pitch/Type
| +---------------------- Series Number
+---------------------------- Advanced Thermal Solutions
```
- ⤷
What are the alternative mounting methods for heat sinks if push-pins are not feasible?
- ⤷ How do I calculate if the 2.49°C/W thermal resistance is sufficient for my specific chip?
- ⤷ What is the difference between Blue Anodized and Black Anodized finishes in terms of thermal performance?