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  • ATS-19F-82-C2-R0

  • AI
    The **ATS-19F-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Thermal Resistance** | 2.49°C/W (at 100 LFM) | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic circuit is critical for longevity and performance: 1. **Thermal Dissipation:** It increases the surface area of the heat source (the semiconductor), allowing air to carry away heat more efficiently. 2. **Junction Temperature Control:** By maintaining a lower $T_j$ (Junction Temperature), it prevents "thermal throttling" in processors and prevents permanent silicon damage. 3. **EMI Shielding (Incidental):** Being a metallic mass, it can occasionally provide minor electromagnetic interference shielding for the chip beneath it, though this is not its primary purpose. --- ### 3. Design Features (pushPIN™ Technology) The "82" and "C2" segments of the part number refer to the specific mounting and thermal performance configurations: * **Fin Design:** This model typically features a **Straight Fin** or **Cross-Cut** pattern designed for specific airflow directions. * **Attachment:** The push-pin mechanism uses a flexible spring-loaded pin to ensure constant pressure between the heat sink and the electronic component, which optimizes the heat transfer through the Thermal Interface Material (TIM). * **Compatibility:** Designed for PCB (Printed Circuit Board) mounting with pre-drilled holes. --- ### 4. Part Number Breakdown ```text ATS - 19 - F - 82 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Color/Finish (Blue Anodized) | | | +------------ Thermal Performance/Kit Variant | | +----------------- Fin Pitch/Type | +---------------------- Series Number +---------------------------- Advanced Thermal Solutions ```
    ✨ Follow-up Questions
    • ⤷ What are the alternative mounting methods for heat sinks if push-pins are not feasible?
    • ⤷ How do I calculate if the 2.49°C/W thermal resistance is sufficient for my specific chip?
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes in terms of thermal performance?