ATS-19F-80-C2-R0
AI

The **ATS-19F-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs).
### 1. Technical Specifications
The following table summarizes the core electronic and mechanical specifications:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | push-PIN™ |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 1.88°C/W (at 200 LFM) |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Fin Style** | Straight (Fine Pitch) |
| **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 15.0mm |
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### 2. Key Component Features
#### A. Material and Thermal Conductivity
The unit is made from high-grade aluminum. The **Blue Anodized** finish is not merely aesthetic; it provides surface protection and slightly increases emissivity, which helps with heat radiation in addition to convection.
#### B. Attachment System (push-PIN™)
Instead of using messy thermal adhesives or tapes, this part uses a spring-loaded push-pin mechanism.
* **Consistency:** Provides uniform pressure across the component (like a CPU or FPGA), ensuring an even thermal interface.
* **Reliability:** Reduces the risk of the heat sink falling off due to vibration or thermal expansion.
#### C. Fin Design
The **Fine Pitch** fin geometry is optimized for forced air cooling (airflow from fans). The straight-fin design allows air to pass through with lower pressure drop, making it efficient for high-density electronic enclosures.
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### 3. Electronic Application Use-Cases
This specific heat sink is typically used for cooling integrated circuits (ICs) that generate significant heat during operation:
1. **Processors:** Low-power CPUs or specialized SoCs.
2. **FPGAs/ASICs:** High-speed logic gates that require constant thermal regulation to prevent "thermal throttling."
3. **Power Electronics:** Voltage regulators or motor drivers that operate in high-ambient-temperature environments.
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### 4. Part Number Breakdown
`ATS-19F-80-C2-R0` follows a specific nomenclature:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **19:** Series designation.
* **F:** Fin Type (Fine).
* **80:** Specific height/configuration code.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision/Packaging status.
- ⤷
What is the thermal resistance of this part at different airflow speeds (LFM)?
- ⤷ What is the required PCB hole size for the push-pin attachment?
- ⤷ Can this heat sink be used with a Phase Change Material (PCM) thermal pad?