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  • ATS-19F-80-C2-R0

  • AI
    The **ATS-19F-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the core electronic and mechanical specifications: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | push-PIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.88°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Style** | Straight (Fine Pitch) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 15.0mm | --- ### 2. Key Component Features #### A. Material and Thermal Conductivity The unit is made from high-grade aluminum. The **Blue Anodized** finish is not merely aesthetic; it provides surface protection and slightly increases emissivity, which helps with heat radiation in addition to convection. #### B. Attachment System (push-PIN™) Instead of using messy thermal adhesives or tapes, this part uses a spring-loaded push-pin mechanism. * **Consistency:** Provides uniform pressure across the component (like a CPU or FPGA), ensuring an even thermal interface. * **Reliability:** Reduces the risk of the heat sink falling off due to vibration or thermal expansion. #### C. Fin Design The **Fine Pitch** fin geometry is optimized for forced air cooling (airflow from fans). The straight-fin design allows air to pass through with lower pressure drop, making it efficient for high-density electronic enclosures. --- ### 3. Electronic Application Use-Cases This specific heat sink is typically used for cooling integrated circuits (ICs) that generate significant heat during operation: 1. **Processors:** Low-power CPUs or specialized SoCs. 2. **FPGAs/ASICs:** High-speed logic gates that require constant thermal regulation to prevent "thermal throttling." 3. **Power Electronics:** Voltage regulators or motor drivers that operate in high-ambient-temperature environments. --- ### 4. Part Number Breakdown `ATS-19F-80-C2-R0` follows a specific nomenclature: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **19:** Series designation. * **F:** Fin Type (Fine). * **80:** Specific height/configuration code. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging status.
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this part at different airflow speeds (LFM)?
    • ⤷ What is the required PCB hole size for the push-pin attachment?
    • ⤷ Can this heat sink be used with a Phase Change Material (PCM) thermal pad?