The **ATS-19F-72-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 35mm | | **Fin Type** | Straight Fin (High Density) | | **Thermal Resistance** | ~1.60 °C/W (at 200 LFM) | --- ### 2. Design Characteristics The part is engineered to maximize surface area and airflow efficiency. Key electronic/mechanical features include: * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T412**, a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink. * **Push Pin Mounting:** It utilizes a tool-free mounting system. The brass push pins pass through pre-drilled holes in the PCB, and the springs apply a specific pressure (clamping force) to ensure optimal thermal contact. * **Straight Fin Profile:** The fins are arranged in a straight pattern, making it ideal for systems with **forced air cooling** (fans) where air travels in a single direction. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **19F** | Series Identifier (Push Pin Series) | | **72** | Specific Size/Geometry Code | | **C3** | Thermal Interface Material (TIM) code | | **R0** | Revision/Standard Packaging code | --- ### 4. Application Use Cases This heat sink is commonly found in: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where high thermal dissipation is required in a small footprint. * **Power Supplies:** Cooling MOSFETs or voltage regulators.