## Technical Overview: ATS-19F-60-C2-R0 The **ATS-19F-60-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components like BGA (Ball Grid Array) packages, CPUs, and GPUs in high-airflow environments. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Mounting Style** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (with Blue Anodized finish) | | **Thermal Resistance** | 1.45°C/W (at 200 LFM) | | **Attachment Method** | Push-pins and Springs | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Component Features #### **A. maxiFLOW™ Fin Geometry** The "C2" in the part number indicates a specific fin design. The maxiFLOW™ geometry features a flared fin structure that increases the surface area for heat dissipation while maintaining low pressure drop. This allows it to perform exceptionally well in forced-air cooling systems. #### **B. pushPIN™ Attachment System** Instead of using messy adhesives or permanent solder, this part uses the **pushPIN™** system: * **Compression Springs:** Ensure even pressure across the component surface for optimal thermal contact. * **Plastic/Brass Pins:** Secure the heat sink to the PCB via pre-drilled holes. #### **C. Thermal Interface Material (TIM)** The part comes with **T766** pre-applied to the base. This is a high-performance thermal pad that fills microscopic air gaps between the heat sink and the electronic chip, ensuring efficient heat transfer from the silicon to the aluminum fins. --- ### 3. Thermal Performance Profile The efficiency of this part varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM (1.0 m/s)** | 1.45 | | **300 LFM (1.5 m/s)** | 1.02 | | **400 LFM (2.0 m/s)** | 0.82 | | **500 LFM (2.5 m/s)** | 0.71 | --- ### 4. Typical Applications * **Telecommunications:** Cooling high-speed networking chips. * **Industrial PC:** Thermal management for processors in harsh environments. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.