The **ATS-19F-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW" series, designed for high-efficiency cooling in constrained spaces. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19F-55-C2-R0 | | **Heat Sink Type** | maxiFLOW | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Resistance** | 4.71°C/W (@ 100 LFM) | | **Airflow Path** | Straight-Fin | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Efficiency The "maxiFLOW" design features a flared fin structure. This increases the surface area for heat dissipation while maintaining a low pressure drop, making it highly effective for cooling surface-mount components like CPUs, GPUs, or FPGAs. #### B. pushPIN™ Attachment System This specific model uses a **pushPIN™** mounting mechanism. - It includes a pre-assembled brass component and a stainless steel spring. - It ensures consistent pressure on the electronic component, which optimizes the thermal interface between the chip and the heat sink. #### C. Thermal Interface Material (TIM) The "C2" suffix in the part number indicates the type of thermal interface material pre-applied to the base. - **Material:** T766 (or equivalent high-performance grease/pad). - **Function:** Fills microscopic air gaps between the component and the heat sink to reduce thermal resistance. --- ### 3. Application Use Cases This heat sink is typically found in: * **Telecommunications:** Network switches and routers. * **Embedded Computing:** Industrial PC processors. * **Power Supplies:** Cooling high-wattage MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Brand). * **19:** Series designation. * **F:** Fin configuration (Straight/Flared). * **55:** Height/Size code. * **C2:** Thermal Interface Material (Blue/High Performance). * **R0:** RoHS Compliance status.