The **ATS-19F-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling integrated circuits (ICs) and other electronic components that generate significant heat during operation. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with Springs) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Resistance** | 18.90 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### A. Push Pin Attachment Unlike adhesive-based heat sinks, the "pushPIN™" system uses a brass or plastic pin with a compression spring. This ensures: * **Constant Pressure:** Maintains uniform contact between the heat sink and the electronic component (CPU, GPU, or FPGA). * **Reliability:** Resistant to vibration and thermal expansion/contraction that often causes adhesive tape to fail over time. ### B. Fin Design (Cross-Cut) The "F" in the part number indicates a specific fin pattern. The cross-cut design allows for **multi-directional airflow**. This is critical in crowded PCB environments where the cooling fan might not be perfectly aligned with the heat sink. ### C. Thermal Interface Material (T766) The unit comes with a pre-applied phase-change material (T766). This eliminates the need for manual thermal paste application, ensuring a low thermal resistance path from the silicon die to the aluminum fins. --- ## 3. Physical Dimensions (Mechanical Drawing) | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 35.00 | | **Width (B)** | 35.00 | | **Height (C)** | 15.00 | | **Pitch (E)** | 40.00 | | **Pitch (F)** | 40.00 | --- ## 4. Application Use-Cases This heat sink is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed network switch chips. 2. **Industrial PCs:** Thermal management for embedded processors. 3. **Power Supplies:** Heat dissipation for MOSFETs and power regulators. 4. **Consumer Electronics:** High-end audio processors or set-top box ICs.