The **ATS-19F-47-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic devices like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table details the mechanical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin | | **Heat Sink Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.30°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Fin Style** | Straight (Cross-Cut) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to describe its physical properties: * **ATS-19**: Refers to the specific series of the pushPIN™ attachment system. * **F**: Indicates a specific mounting hole pattern or fin configuration. * **47**: Represents the specific dimensions and thermal profile index. * **C2**: Refers to the material and finish (usually Aluminum with a Blue Anodized coating). * **R0**: Indicates the revision number or packaging type. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical part, its electronic role is critical in high-power circuits: * **Heat Dissipation:** It increases the surface area of the heat-generating component (e.g., an Integrated Circuit), allowing ambient air to carry heat away more efficiently. * **Thermal Interface:** It is typically used in conjunction with a Thermal Interface Material (TIM) like thermal paste to ensure maximum conductivity between the chip and the aluminum. * **Attachment System:** This model uses a **push-pin** mechanism with a brass or plastic pin and a spring. This ensures constant pressure against the electronic component, which is vital for maintaining thermal contact under vibration or thermal expansion. --- ### 4. Typical Applications * **Embedded Systems:** Cooling small form-factor motherboards. * **Power Electronics:** Dissipating heat from voltage regulators and MOSFETs. * **Telecommunications:** Used in routers and switches where airflow is localized.