The **ATS-19F-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 10.03 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Pattern** | Straight Fin | --- ### 2. Physical Design Details The physical construction is optimized for airflow and ease of assembly in electronic systems: * **Heat Sink Profile:** The 20mm height offers a balance between surface area for cooling and clearance in low-profile electronic enclosures. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a high-performance thermal phase change material or grease that fills the microscopic air gaps between the component and the heat sink. * **Fin Geometry:** The straight fin design is ideal for systems with directed airflow (forced convection), allowing air to pass through the channels efficiently. --- ### 3. Mounting System (pushPIN™) One of the defining "electronic parts" of this assembly is the mechanical mounting hardware: 1. **Push-Pins:** These are plastic or brass pins that lock into pre-drilled holes on the Printed Circuit Board (PCB). 2. **Compression Springs:** Every pin is paired with a stainless steel spring. This ensures **consistent downward pressure**, which is critical for maximizing heat transfer and preventing the component from cracking due to over-tightening. --- ### 4. Application Use Cases This component is commonly found in: * **Networking Hardware:** Switches, routers, and high-speed modems. * **Industrial PCs:** Compact computing modules where heat buildup is a risk. * **Power Supplies:** Cooling voltage regulators or MOSFETs.