The **ATS-19F-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### 1. Key Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push PIN | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm | | **Height** | 25mm | | **Fin Style** | XC-Cut (Cross-cut) | | **Thermal Resistance** | 1.45°C/W (at 200 LFM) | | **Attachment Method** | Push Pin (Brass) | --- ### 2. Functional Components #### A. The Heat Sink Body The body is constructed from aluminum for high thermal conductivity. The **XC-Cut** design features a cross-cut pattern of fins. This allows for multi-directional airflow, making it ideal for systems where air may be coming from various angles within a chassis. #### B. The Push Pin Mechanism Instead of using adhesive tape or screws, this part utilizes **brass push pins** with a stainless steel spring. * **Purpose:** Provides a consistent "clamping force" against the electronic component (CPU, FPGA, or GPU). * **Stability:** The spring-loaded mechanism ensures that the thermal interface material (TIM) remains compressed even under mechanical vibration. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates the inclusion of a pre-applied high-performance thermal pad or phase-change material on the base, ensuring there are no air gaps between the chip and the aluminum. --- ### 3. Usage Context This part is typically found in: * **Telecommunications:** High-speed routers and switches. * **Industrial PC:** Embedded systems requiring passive or active cooling. * **Power Electronics:** Cooling MOSFETs or power modules. ### 4. Thermal Performance Comparison To understand how it performs under different airflow conditions (Measured in Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 2.71 | | 200 (Medium) | 1.45 | | 400 (High) | 1.03 |