The **ATS-19F-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19F-34-C2-R0 | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 3.81°C/W @ 100 LFM (Linear Feet per Minute) | | **Attachment Method** | pushPIN™ (Brass spring-loaded pins) | | **Fin Type** | XC-CUT (Cross-cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied thermal grease) | --- ### 2. Key Design Features * **XC-CUT Fin Pattern:** This design uses cross-cut fins which allow for multi-directional airflow. This is critical in high-density PCB layouts where airflow may not be strictly linear. * **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this part uses a mechanical push-pin system. This ensures consistent pressure across the component surface, which optimizes heat transfer. * **Material and Finish:** Made from high-grade aluminum for lightweight thermal conductivity. The blue anodized finish provides a protective layer against corrosion and improves radiative heat emission. * **Pre-applied TIM:** It comes with **T766 thermal interface material**, which simplifies assembly and ensures a high-quality thermal bond between the heat sink and the chip. ### 3. Applications This specific heat sink is typically used in: 1. **Telecommunications:** Cooling of networking chips and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and power converters that generate significant localized heat. ---