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  • ATS-19F-30-C2-R0

  • AI
    The **ATS-19F-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 1.31°C/W (at 200 LFM) | | **Flow Orientation** | Vertical / Straight Fin | | **RoHS Status** | Compliant | --- ### Key Design Components #### 1. Heat Sink Body (Aluminum) The body is made of lightweight aluminum, which offers excellent thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly improves emissivity for radiant heat transfer. #### 2. straight-fin Geometry The "F" in the part number denotes a **Straight Fin** design. This is optimized for systems with a clear, directional airflow (forced convection). The fins increase the surface area available to the air, allowing heat to be carried away more efficiently. #### 3. pushPIN™ Attachment System This specific model uses a "pushPIN" mechanism rather than thermal adhesive. This provides several benefits: * **Constant Pressure:** Ensures a tight interface between the heat sink and the component. * **Reliability:** Resistant to vibration and shocks. * **Reusability:** Easy to install and remove without damaging the PCB. #### 4. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies the inclusion of a pre-applied high-performance Thermal Interface Material (thermal pad or grease). This fills microscopic air gaps between the component and the heat sink base to maximize heat transfer. --- ### Comparison of Airflow Performance Thermal resistance varies based on the Airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.31 | | 200 (1.0 m/s) | 1.31 | | 400 (2.0 m/s) | 0.93 | | 600 (3.0 m/s) | 0.77 | ---
    ✨ Follow-up Questions
    • ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?
    • ⤷ What is the specific PCB hole size required for the pushPIN attachment on this model?
    • ⤷ Can this heat sink be used for passive cooling without a fan?