ATS-19F-30-C2-R0
AI

The **ATS-19F-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
The part number follows a specific nomenclature used by ATS. Below are the primary specifications:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Thermal Resistance** | 1.31°C/W (at 200 LFM) |
| **Flow Orientation** | Vertical / Straight Fin |
| **RoHS Status** | Compliant |
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### Key Design Components
#### 1. Heat Sink Body (Aluminum)
The body is made of lightweight aluminum, which offers excellent thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly improves emissivity for radiant heat transfer.
#### 2. straight-fin Geometry
The "F" in the part number denotes a **Straight Fin** design. This is optimized for systems with a clear, directional airflow (forced convection). The fins increase the surface area available to the air, allowing heat to be carried away more efficiently.
#### 3. pushPIN™ Attachment System
This specific model uses a "pushPIN" mechanism rather than thermal adhesive. This provides several benefits:
* **Constant Pressure:** Ensures a tight interface between the heat sink and the component.
* **Reliability:** Resistant to vibration and shocks.
* **Reusability:** Easy to install and remove without damaging the PCB.
#### 4. Thermal Interface Material (TIM)
The "R0" at the end of the part number usually signifies the inclusion of a pre-applied high-performance Thermal Interface Material (thermal pad or grease). This fills microscopic air gaps between the component and the heat sink base to maximize heat transfer.
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### Comparison of Airflow Performance
Thermal resistance varies based on the Airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 2.31 |
| 200 (1.0 m/s) | 1.31 |
| 400 (2.0 m/s) | 0.93 |
| 600 (3.0 m/s) | 0.77 |
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- ⤷
How does blue anodization affect the thermal performance compared to bare aluminum?
- ⤷ What is the specific PCB hole size required for the pushPIN attachment on this model?
- ⤷ Can this heat sink be used for passive cooling without a fan?