The **ATS-19F-27-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Straight Fin | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 12.24°C/W (Unducted) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | --- ### 2. Key Features and Design #### A. pushPIN™ Attachment System The "19F" in the part number indicates the use of the ATS **pushPIN™** system. This design allows for: * **Fast Assembly:** Easy installation into pre-drilled holes on a PCB. * **Constant Pressure:** A high-performance compression spring ensures uniform pressure across the interface for maximum heat transfer. * **Stability:** Secure mounting that resists vibration and mechanical shock. #### B. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides corrosion resistance and increases surface emissivity, slightly improving radiant cooling. #### C. Thermal Interface Material (TIM) The "C2" designation usually refers to the pre-applied thermal interface material. ATS typically uses **T766**, a high-performance thermal grease, to fill microscopic air gaps between the component and the heat sink. --- ### 3. Performance Data Thermal performance is highly dependent on airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 | 0.5 | 12.24 °C/W | | 300 | 1.5 | 4.47 °C/W | | 500 | 2.5 | 2.99 °C/W | | 700 | 3.5 | 2.39 °C/W | --- ### 4. Typical Applications * **Power Supplies:** Cooling MOSFETs and Voltage Regulators. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Telecommunications:** Cooling small-form-factor networking chips.