công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-19F-25-C2-R0

  • AI
    The **ATS-19F-25-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 25mm | | **Attachment Type** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: - **ATS-19**: Indicates the specific series or profile type. - **F**: Denotes the material or fin configuration (Fine-pitch). - **25**: Refers to the height of the heat sink (25mm). - **C2**: Represents the color and finish (Blue Anodized). - **R0**: Indicates the revision or specific packaging standard. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic system is critical for operational stability: 1. **Heat Dissipation:** It increases the surface area of the heat-generating component, allowing for better cooling through convection. 2. **Thermal Interface:** The pre-applied **T766** material ensures that microscopic air gaps between the chip and the heat sink are filled, maximizing thermal conductivity. 3. **Mechanical Retention:** The push-pin mechanism provides consistent pressure against the component, which is vital for maintaining a solid thermal bond without over-stressing the PCB. --- ### 4. Thermal Performance Data Performance varies based on airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 6.26 | | 200 (Unducted) | 3.12 | | 400 (Unducted) | 1.90 | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between T766 and other thermal interface materials?
    • ⤷ How do I calculate if this heat sink is sufficient for my chip's TDP?
    • ⤷ Are there alternative mounting options if push-pins don't fit my PCB?