ATS-19F-25-C2-R0
AI

The **ATS-19F-25-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Attachment Type** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
| **Fin Style** | Straight Fin |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by ATS to identify the component's features:
- **ATS-19**: Indicates the specific series or profile type.
- **F**: Denotes the material or fin configuration (Fine-pitch).
- **25**: Refers to the height of the heat sink (25mm).
- **C2**: Represents the color and finish (Blue Anodized).
- **R0**: Indicates the revision or specific packaging standard.
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### 3. Key Electronic Functions
While the heat sink itself is a passive mechanical part, its role in an electronic system is critical for operational stability:
1. **Heat Dissipation:** It increases the surface area of the heat-generating component, allowing for better cooling through convection.
2. **Thermal Interface:** The pre-applied **T766** material ensures that microscopic air gaps between the chip and the heat sink are filled, maximizing thermal conductivity.
3. **Mechanical Retention:** The push-pin mechanism provides consistent pressure against the component, which is vital for maintaining a solid thermal bond without over-stressing the PCB.
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### 4. Thermal Performance Data
Performance varies based on airflow (Measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Unducted) | 6.26 |
| 200 (Unducted) | 3.12 |
| 400 (Unducted) | 1.90 |
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- ⤷What is the difference between T766 and other thermal interface materials?
- ⤷ How do I calculate if this heat sink is sufficient for my chip's TDP?
- ⤷ Are there alternative mounting options if push-pins don't fit my PCB?