ATS-19F-24-C2-R0
AI

The **ATS-19F-24-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits.
Below is the detailed breakdown of its specifications and electronic application characteristics.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Base Material** | Aluminum (typically Blue Anodized) |
| **Thermal Resistance** | 2.15°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Component Analysis
#### A. The Design (maxiFLOW™)
This heat sink features a **flared fin design**. Unlike standard straight fins, the fins on this model curve outwards. This increases the surface area and enhances the cooling performance in environments where airflow might be limited or uneven.
#### B. The pushPIN™ Attachment
The "R0" in the part number indicates the mounting hardware. The pushPIN™ system uses a flexible, spring-loaded mechanism that ensures:
* **Constant Pressure:** Maintains optimal contact between the heat sink and the chip.
* **Safety:** Prevents damage to the PCB or the electronic component during installation.
* **Reliability:** Tested for shock and vibration resistance.
#### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base. This is a high-conductivity thermal paste/pad that fills microscopic air gaps between the component and the heat sink, ensuring efficient heat transfer.
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### 3. Application Use Cases
This part is commonly found in the following electronic sectors:
* **Telecommunications:** High-speed routers and switches.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Electronics:** Cooling for MOSFET arrays or voltage regulators.
* **Data Centers:** Server blade components that require precise thermal management in restricted spaces.
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### 4. Part Number Decoder
| Code | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Brand) |
| **19F** | Series/Geometry (maxiFLOW™ Flared Fin) |
| **24** | Specific dimension/configuration code |
| **C2** | Blue Anodized Finish |
| **R0** | pushPIN™ Mounting Attachment |
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What are the alternative mounting methods for ATS heat sinks if pushPIN is not suitable?
- ⤷ How does 'Blue Anodized' finishing affect the thermal performance compared to bare aluminum?
- ⤷ What is the recommended airflow direction for flared fin heat sinks?