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  • ATS-19F-24-C2-R0

  • AI
    The **ATS-19F-24-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. Below is the detailed breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Material** | Aluminum (typically Blue Anodized) | | **Thermal Resistance** | 2.15°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Analysis #### A. The Design (maxiFLOW™) This heat sink features a **flared fin design**. Unlike standard straight fins, the fins on this model curve outwards. This increases the surface area and enhances the cooling performance in environments where airflow might be limited or uneven. #### B. The pushPIN™ Attachment The "R0" in the part number indicates the mounting hardware. The pushPIN™ system uses a flexible, spring-loaded mechanism that ensures: * **Constant Pressure:** Maintains optimal contact between the heat sink and the chip. * **Safety:** Prevents damage to the PCB or the electronic component during installation. * **Reliability:** Tested for shock and vibration resistance. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-conductivity thermal paste/pad that fills microscopic air gaps between the component and the heat sink, ensuring efficient heat transfer. --- ### 3. Application Use Cases This part is commonly found in the following electronic sectors: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Cooling for MOSFET arrays or voltage regulators. * **Data Centers:** Server blade components that require precise thermal management in restricted spaces. --- ### 4. Part Number Decoder | Code | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **19F** | Series/Geometry (maxiFLOW™ Flared Fin) | | **24** | Specific dimension/configuration code | | **C2** | Blue Anodized Finish | | **R0** | pushPIN™ Mounting Attachment |
    ✨ Follow-up Questions
    • ⤷ What are the alternative mounting methods for ATS heat sinks if pushPIN is not suitable?
    • ⤷ How does 'Blue Anodized' finishing affect the thermal performance compared to bare aluminum?
    • ⤷ What is the recommended airflow direction for flared fin heat sinks?