The **ATS-19F-23-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling electronic components like processors, FPGAs, and ASICs. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 15.00mm | | **Thermal Resistance (Unducted)** | 12.01 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.90 °C/W @ 200 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Elements #### A. Fin Geometry (maxiFLOW™) This heat sink features a **spread-fin design**. Unlike standard square-fin sinks, the fins are tapered and angled to maximize surface area while reducing pressure drop. This allows for higher airflow efficiency in constrained spaces. #### B. pushPIN™ Attachment The part uses the **pushPIN™** mounting system, which includes: * **Compression Springs:** Ensure even pressure across the component to maximize thermal transfer. * **Brass Bolts/Plastic Pins:** Provide a secure mechanical connection to the PCB, preventing the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The **C2** in the part number indicates the specific TIM used (T766). This is a high-performance phase-change material or grease pre-applied to the base of the heat sink, ensuring there are no air gaps between the component and the metal. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **19F:** Product Family (maxiFLOW™ series). * **23:** Specific dimensions/fin configuration code. * **C2:** Thermal Interface Material type (T766). * **R0:** Revision/Standard packaging code. --- ### 4. Application Use Cases This component is typically found in: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Embedded Computing:** Cooling industrial PC processors. 3. **Power Electronics:** Managing heat for large MOSFET arrays or power modules.