The **ATS-19F-210-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number follows a specific nomenclature from the manufacturer, **Advanced Thermal Solutions (ATS)**. | Parameter | Specification | | :--- | :--- | | **Heat Sink Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin with Brass Springs | | **Thermal Resistance** | 5.18°C/W (at 200 LFM) | | **Dimensions** | 54mm x 54mm x 12.7mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Features ### A. Material and Coating * **Aluminum AL6063:** Provides a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Not only aesthetic but increases surface emissivity and provides corrosion resistance. ### B. Mounting Mechanism (Push-Pins) The "Push-Pin" system consists of a plastic pin and a brass spring. * **Uniform Pressure:** The springs ensure that a consistent downward force is applied to the chip, optimizing the contact with the Thermal Interface Material (TIM). * **Pre-drilled Holes:** This component requires specific holes in the PCB for mounting, ensuring the heat sink does not shift during vibration or shipping. ### C. Thermal Interface Material (TIM) This part comes with **T766** pre-applied to the base. * It fills the microscopic air gaps between the heat source (the chip) and the heat sink base, significantly reducing thermal resistance. --- ## 3. Physical Dimensions (Summary) | Dimension | Measurement | | :--- | :--- | | **Width / Length** | 54.0 mm | | **Height** | 12.7 mm | | **Pin Pitch** | Specific to standard PCB layouts | --- ## 4. Usage Considerations * **Airflow:** Since it is a straight-fin design, it performs best in environments with directed forced-air cooling (fans). * **Height Profile:** At 12.7mm, it is considered a low-profile heat sink, making it ideal for 1U servers or compact electronic enclosures.