The **ATS-19F-20-C2-R0** is a specific electronic component belonging to the **Heat Sink** category, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed for high-performance cooling of electronic packages like BGA (Ball Grid Array). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-19F-20-C2-R0 | | **Heat Sink Type** | maxiFLOW™ (High Performance) | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 25.00 mm | | **Thermal Resistance** | 1.84 °C/W (at 200 LFM) | | **Fin Pattern** | Spread Fin (Tapered) | --- ### 2. Breakdown of the Part Number The part number is structured to define the geometry and mounting options: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **19F:** Refers to the specific fin geometry and spacing within the maxiFLOW line. * **20:** Represents the height of the heat sink (25.00 mm in this specific series configuration). * **C2:** Refers to the color and finish (Blue Anodized). * **R0:** Revision code/Packaging indicator. --- ### 3. Key Electronic/Thermal Features * **pushPIN™ Attachment:** This model uses a hardware-based attachment system (spring-loaded pins) rather than adhesive tapes. This provides consistent pressure for better thermal interface contact and makes it more reliable in high-vibration environments. * **Thermal Performance:** With a thermal resistance of roughly **1.84 °C/W** at moderate airflow (200 LFM), this part is capable of dissipating significant heat from high-speed processors or FPGAs. * **Airflow Efficiency:** The "maxiFLOW" design uses a flared fin structure. This reduces pressure drop and increases the surface area for heat dissipation compared to standard straight-fin heat sinks. * **Material:** Made from 6063 aluminum, which offers a good balance between weight, thermal conductivity, and cost. --- ### 4. Applications This part is commonly used in the following electronic sectors: * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Computing:** For industrial PC processors. * **Power Supplies:** Heat management for power MOSFETs or IGBTs. * **Data Centers:** Cooling of high-density server components.