The **ATS-19F-19-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" product line, designed primarily for cooling electronic components like BGA (Ball Grid Array) chips. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 25mm | | **Attachment Method** | **pushPIN™** (Spring-loaded pins) | | **Thermal Resistance** | 2.10° C/W (@ 200 LFM) | | **Pressure Drop** | 0.11 in-H2O (@ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a structured nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **19F**: Series/Type (Often refers to the fin pattern or specific design family). * **19**: Specific iteration or sizing code within the series. * **C2**: Indicates the Material/Finish (Blue Anodized Aluminum). * **R0**: Revision or packaging indicator. --- ### 3. Key Electronic Design Features #### A. maxiFLOW™ Fin Geometry Unlike standard straight-fin heatsinks, the ATS-19F-19-C2-R0 features a tapered fin design. This geometry is engineered to maximize surface area for heat dissipation while minimizing pressure drop, allowing air to flow more effectively through the fins even in congested PCB environments. #### B. pushPIN™ Attachment This part uses a specific mounting mechanism: * **Spring-loaded pins:** These provide a precise amount of pressure (load) on the electronic component (CPU/GPU/FPGA). * **Reliability:** It ensures a secure fit that is resistant to shock and vibration, which is critical for industrial or telecommunications hardware. #### C. Thermal Interface Material (T766) The part comes with **T766** pre-applied. This is a phase-change or high-performance thermal grease that fills the microscopic air gaps between the component and the heatsink, significantly reducing thermal resistance. --- ### 4. Typical Applications This component is generally used to cool high-heat-generating semiconductors in the following fields: * **Telecommunications:** Network switches and routers. * **Embedded Computing:** Industrial PC boards. * **Power Electronics:** Voltage regulators and high-speed processors.